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Oxford Instruments Plasmalab80 Plus: combined RIE, PE & PECVD instrument

Name and Model (Year of Manufacture/Installation)

Oxford Instruments Plasmalab80Plus  (-04/-04)

General Information

Combined instrument for reactive ion etching (RIE), plasma etching (PE) or plasma enhanced chemical vapour deposition (PECVD)

Key Specifications       


Wafer size Up to 7 x 2", 4 x 3", 2 x 4" or one 6" or 8"
Substrate temperature -150 °C to +400 °C


Key Features

Reactive Ion Etching

  • Available gases: Ar, O2, SF6 ja CHF3

Chemical Vapor Deposition

  • Available process gases: N2, N2O, NH3, CH4, SiH4/N2, CF4/O2

General features

  • Materials etched:
  • Materials grown:
Location, Responsible Person

NSC clean room,  Jussi Toppari / Kimmo Kinnunen

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