26.09.2016

F & K Delvotec 5430

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F & K Delvotec 5430 semi-automatic fine wire wedge bonder

 FetK5430bonder.jpg

F & K Delvotec wedge wire bonder. (Picture taken by Saku Mattila.)

Name and Model (Year of Manufacture / Installation)

F & K Delvotec 5430 (?/2008)

General Information

Semi-automatic fine wire wedge bonder for contacting devices. Uses gold and aluminium wire.

Key Specifications        
  • Bonding method: ultrasonic and thermocompression
  • Adjustable compressive force, time, and temperature
  • 17,5-75 µm gold and aluminium wire
  • Standard work height: 136 mm (mid Z stroke)
  • Programmable bond force from 15 up to 150 cN

Bonding heads available: Deep access, fine wire, gold ball, heavy wire

Key Features

The device is used in making electrical connections between microelectronic components and their packages. The compressive force can be carefully controlled which enables also processing of brittle materials. 

  • Standard work holder Ø60 mm
  • Mechanical and vacuum clamping
  • Stitch bonding
  • Heated work holder with digital temperature control up to 360 °C
  • Motor driven Y & Z-axis (step back)
  • Touch-down sensor initiates bonding on actual contact with substrate
  • Standard rectangular, standard triangular, single and double reverse, stitch; clamp and table tear loops
  • Program modes: manual, semi-automatic, automatic and multi wire
Location, Responsible Person

Nanoscience Center, YN040.1 / Kimmo Kinnunen

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