26.09.2016

MicroAce 3

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Load Point MicroAce 3 dicing saw

 Microace3.jpg

Name and Model (Year of Manufacture / Installation)

 Load Point MicroAce 3 (?/?)

General Information

Dicing saw for dicing of silicon wafers.

Key Specifications        
  • Wide range of materials: for example Silicon, Ferrite, Glass, Germanium, PZT and Sapphire
  • Maximum substrate size: Diameter up to Ø152 mm
  • Spindle speed: 3000…40000 rpm

Four axes:

  • X-axis: The lateral axis and cutting stroke. Feed rate = 0,1 mm/sec
  • Y-axis: The longitudinal and positional axis of the spindle. Resolution = 2 µm
  • Z-axis: The vertical axis, which controls the depth of cut. Precision = less than 1 µm
  • Teta-axis is the angular rotation of the worktable about the vertical axis. Resolution = 0,005°
Key Features
  • A water cooling system.
  • Silicon wafers can be diced with a certain cut depth.
  • Camera for alignment (twin videoscope)
  • Semi automatic mode.
Location, Responsible Person

Nanoscience Center / Kimmo Kinnunen, Tarmo Suppula

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